SHIN-ETSU Products

SHIN-ETSU SIFEL^® potting gel provides excellent low stress encapsulation performance for sensitive electronic components.

SHIN-ETSU SIFEL^® potting gel has been proven to protect electronics from long term exposure to harsh environments such as fuels, solvents and chemicals.

Values listed are typical values and do not constitute a specification.

Product Name	SIFEL8070A/B	SIFEL8370A/B	SIFEL8470	SIFEL8570A/B
Features	Two-component Heat cure Better low temperature flexibility	Two-component Heat cure	One-component Heat cure	Two-component Room temperature cure
Before curing properties
Appearance	Slightly translucent liquid, Pale yellow	Slightly translucent liquid, Pale yellow	Slightly translucent liquid, Pale yellow	Slightly translucent liquid, Pale yellow
Viscosity at 23ºC (ASTM D1804)	A: 2.0 Pa·s (20 Poise)	A: 3.4 Pa·s (34 Poise)	3.2 Pa·s (32 Poise)	A: 3.2 Pa·s (32 Poise)
Viscosity at 23ºC (ASTM D1804)	B: 2.5 Pa·s (25 Poise)	B: 2.9 Pa·s (29 Poise)	3.2 Pa·s (32 Poise)	B: 3.0 Pa·s (30 Poise)
Density at 25ºC (ASTM D4052)	A: 1.85g/cm³	A: 1.86g/cm³	1.84g/cm³	A: 1.86g/cm³
Density at 25ºC (ASTM D4052)	B: 1.79g/cm³	B: 1.83g/cm³	1.84g/cm³	B: 1.82g/cm³
Pot life	≥ 8 hr	≥ 24 hr	-	3 hr
After curing properties
Cure Condition	120 ºC/1hr	120 ºC/1hr	150 ºC/1hr	23 ºC/24hr
Hardness, Penetration (ASTM D1403)	70	70	70	70